Japan ECOW develops a new generation of direct spray organic semiconductor material technology
Recently, Japan's New-Generation Coating-Type Electronic Component Technology Research Alliance (ECOW) has made a breakthrough by developing a novel method for directly spraying organic semiconductor materials. This innovative technology, known as electrostatic spray deposition (ESD), is set to become the third major technique in organic semiconductor film formation, offering an alternative to traditional methods like vacuum evaporation and coating techniques such as spin coating and inkjet printing. The alliance consists of eight groups, including Saitama University, the Institute of Physical Chemistry, Cornell University, Toray Engineering, and FLOX, all working together to advance this cutting-edge technology. One of the key advantages of ESD is its ability to combine the best features of both vacuum evaporation and coating technologies. In ESD, the particles emitted from the nozzle are extremely fine, and before they reach the cathode, most of the solvent evaporates, resulting in a film quality that closely resembles that achieved through vacuum evaporation. At the same time, this process retains the benefits of coating methods—such as room temperature operation, no need for vacuum conditions, and the ability to produce large-area films efficiently. These features make ESD a promising solution for scalable and cost-effective manufacturing of organic semiconductors. According to ECOW, the goal is to establish mass production techniques by early 2016 and begin commercial product supply in 2017. This development could significantly impact industries such as flexible electronics, wearable devices, and next-generation displays. With continued research and collaboration among the participating institutions, ESD may soon revolutionize how organic semiconductors are manufactured, paving the way for more efficient and sustainable electronic solutions in the future.
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